1. Product application
Solder mask exposure, the high temperature baking is used to promote the initial hardening of the ink to prevent the ink from being scratched by the roller.

2. Product specifications
Plate size: 515mm × 625mm max (customizable)
Thickness: 0.07~0.8mm
Output capacity: ≥ 4200pnl / day
heating rate: ≥ 6 ° C / min
Constant temperature capacity: ± 2 °C

3, product features
Ultra-thin board processing capacity, the working space will not touch the printed substrate
High cleanliness equipment, drying line internal use Class1000Hepa filter
Avoids blind corner design inside the oven, closes the dead angle, forms a regular cavity, and the plate warpage can be processed.