Our ServicesIntroduce advanced concepts and cutting-edge technology to China's electronics-related industries

• PCB Equipment and Materials

  • CCD Alignment Induction Bonding Machine
  • Full Automatic Trimming Machine
  • Full Automatic Lay-up & Break Down system
  • Post-Etching Puncher
  • Film AOI Machine

• FPCB Equipment and Materials

  • Vacuum RTR Plasma Treatment
  • Automatic Coverlay Bonding Machine
  • Full Automatic Layup & Break Down System
  • RTR Etching System & Wet Process System
  • FPCB RTR AOI

• IC Substrate,MSAP Equipment and Materials
  

  • Non-contact Vertical Develop Machine
  • Vertical Continuous Plating Machine
  • Vacuum Hot Press Machine
  • Non-contact 3D Profiler
  • Full Automatic Layup & Break Down System

• Semiconductor Equipment and Materials

  • LG DAF material
  • LG BGT material
  • Etching etching equipment
  • Wafer plating equipment

• COF Project

  • COF full process integration solution
  • Wet process equipment
  • Quality inspection equipment
  • Process post-processing tool
  • Full process auxiliary materials, consumables

• PLP Project

  • Plasma Cleaning & Descum machi
  • Sputtering & Coating machine
  • PR Developing/Stripping
  • Seed（Cu/Ti）layer etching
  • RDL plating

• Metal-etching Equipment

  • Lead Frame lead frame
  • QFN half etching
  • Smart Card

• Others

  • OLED
  • TP