1.Product application
Surface treatment of electroplating gold on the copper surface of the circuit board to reduce oxidation of the product and improve solderability or bonding force

2. Product specification
Plate size: board width: 509~515 mm, board length: 619~625 mm
plate thickness range: 0.07-0.8mm
Uniformity: nickel thickness 8±2um, gold thickness 0.6±
0.1um Equipment capacity: ≥2300pnl/day(24H)
Equipment size: L 34m× W 8m× H 5m

3, Product Features
Automatic loading and unloading reduces manual splint damage
Optimized electrode structure and air knife design reduces Au waste
Equipment maintenance is easy and product switching is fast
Customized anode and plating network achieve good uniformity