1.Product application
By etching the organic matter by plasma action, it can roughen the solder mask surface and clean the copper surface dirt or reduce the undercut after development.

2 Product specifications
Plate size: 515mm × 625 mm max
Thickness range: 0.07mm ~0.8mm
Equipment size: equipment length ≤5.0m, width ≤4.0m, height ≤3.0m
Bite amount: 0.5~1.0 μm, 0.035~0.062g
Electrical specifications: three-phase 220V 50/60HZ, three-phase five-wire system

3 Product features
Good bite uniformity
Structure design for easy cleaning and maintenance
High stability horizontal or vertical customized design