1. Product application
Mainly used in the printing and processing of solder resist ink

2. Product specifications
Plate size: 515mm × 625mm max (customizable)
Plate thickness: 0.04~2.0mm
Production speed: 20~500mm/sec (digital setting )
the CCD the FOV: 7.5mm × 7mm

3, Product characteristics
the optical gripping target positioning, high-precision printing
Thin printing processing capacity for the ink, plugging printed
Fully automated process to reduce smearing or trailing undesirable phenomena take
Digital intelligent parameter control