1.Product application
 The vertical gantry line method removes the slag in the hole after punching, and chemically sinks copper on the surface of the hole wall to realize conduction

2. The product specification
Size of the plate: 515mm×625mm max ( Customized)
Thickness: 0.034~0.8mm
Blind hole capacity: 50um min Thickness ratio 1:1
through hole capacity: 60um min Thickness ratio maximum 6:1
Output capacity: ≥5280pnl/day

3. Product characteristics
Stable Guide rail transmission
Automatic syrup adding system
Fully automatic upper and lower board system reduces hand-held board loss
Ultra-thin board processing capability and customization requirements for special requirements