CCD Alignment Induction Bonding Machine Full Automatic Trimming Machine Full Automatic Lay-up & Break Down system Post-Etching Puncher Film AOI Machine Vacuum RTR Plasma Treatment Automatic Coverlay Bonding Machine Full Automatic Layup & Break Down System RTR Etching System & Wet Process System FPCB RTR AOI Non-contact Vertical Develop Machine Vertical Continuous Plating Machine Vacuum Hot Press Machine Non-contact 3D Profiler Full Automatic Layup & Break Down System LG DAF material LG BGT material Etching etching equipment Wafer plating equipment COF full process integration solution Wet process equipment Quality inspection equipment Process post-processing tool Full process auxiliary materials, consumables Plasma Cleaning & Descum machi Sputtering & Coating machine PR Developing/Stripping Seed（Cu/Ti）layer etching RDL plating Lead Frame lead frame QFN half etching Smart Card OLED TP Brand RTR AOI Vacuum RTR Plasma Treatment Automatic Coverlay Bonding Machine Full Automatic Layup & Break Down System RTR Etching System & Wet Process System Automatic RTR PP Press Machine Automatic RTR Coverlay Step Press Machine Vertical Continuous Plating Machine
+86 755 2996 9595 
info@mindup.cn