Welcome to the official website of Mindup Technoloogy

WeChatScan and follow the official WeChat 中文 English

Shenzhen Mindup Technology Co., Ltd.

Product

Automatic Coverlay Bonding Machine

Applications:Dedicated to FPCB cover film bonding, optical automatic alignment, complete automatic film-to-chip fit action

Manufacturer: Chengyi Automation

Place of Origin:Mainland China

Service Hotline:+86 755 2996 9595

Product manual
1.Product application
Dedicated to FPCB cover film bonding, realize optical automatic alignment, complete automatic film-to-chip bonding action

2. Product specifications
FPCB size: Sheet-Min: 250 × 125mm Max: 250 × 500mm
CLV size : Sheet-Min: 250 × 120mm Max: 250 × 310mm
Applicable type: Support 1FPC + 1 size Dimensions CLV
alignment accuracy: ± 0.05mm
Line efficiency: T / T 1FPC + 1CVL: 8s; 1FPC + 2CVL: 14s; 1FPC+3CVL: 20s

3. Product Features
Fully automatic FPCB-to-chip CLV high-efficiency fit
Fully automatic loading and unloading, reducing manpower and improving performance
Panoramic camera + four-axis robot + servo control to achieve high alignment accuracy
CVL indenter Adaptive flatness control, quick-change cushioning material overlay head to avoid damage to FPC