1.Product application
Complete the circuit copper plating thickening on the surface of the circuit board, which can be used for full-plate electroplating, pattern plating blind hole or through-hole filling plating

2. Product specification
plate size: 515mm × 625mm max (can be customized)
Thickness capability : 0.034~0.8mm
Blind hole capacity: 50um min Thickness ratio maximum 1:1
Through hole capacity: 60um min Thickness ratio maximum 6:1
Output capacity: ≥1100pnl/day

3. Product characteristics
Plating uniformity and filling Hole capacity, customized electrode design
Automatic addition system, CuO automatic addition and dustproof design
Easy maintenance and fast product switching.
Fully automatic upper and lower plates reduce manual clamping damage