1.Product application
Before the multi-layer PCB board are pressed, the CCD alignment method is used to melting and cooling the electromagnetic preheating of the prepreg to realize the pre-alignment and pre-bonding function between the core board and the core board.

2. Product specifications
Plate size: Min: 300×460mm, Max: 760×610mm
Plate thickness: 10mm max. (40 layer)
Alignment accuracy: ±20um
Equipment size: Min: 300×460mm, Max: 760×610mm
CCD FOV: 10×8mm

3. Product Features
No need for inner layer punching of core board and PP, saving personnel and equipment cost.
CCD alignment avoids the influence of punching deviation of inner layer board, and improves the precision of alignment. Multiple sets of products can be fused at one time. Plates are automatically charged and stacked to improve production efficiency.