COF-chip on film, film flip chip technology, that is, the chip is mounted on the flexible film to realize the output of the chip I/O, which is a kind of package form, which is common in small-sized panels, such as mobile phone, Ipad and other liquid crystal module products. . Now the LCD module's assembly technology can complete smaller and thinner volumes, which should belong to COG and COF. Due to the limitation of panel layout and the same panel size, COF can achieve greater resolution than COG, with OLED. As well as a large number of applications for comprehensive screens, the demand for COF by major manufacturers is also growing.

Our company has full process integration capability in the field of COF. We have rich experience in wet process equipment, quality inspection equipment, process post-treatment tools and full-process auxiliary materials and consumables. At the same time, single-sided COF, double-sided COF, etching Both the process and the SAP process have practical mass production experience and look forward to contributing to the development of the domestic COF industry.