1.Product application
Vertical non-contact development of the parts after solder mask or film exposure, remove unnecessary ink or dry film

2, product specification
Plate size: 516mm (W) × 626mm (L) max (Customizable)
Thickness: 0.034-0.8mm (dry film); 0.07-1.2mm (solder resistance)
Equipment Linespeed: 1.0~3.0m/min adjustable (dry film); 0.5~5.0m/min
Adjustable (resistance welding)developing capacity: dry film pitch 20um, solder resist green oil bridge 40±4um, window opening 50±5um
Development uniformity: development uniformity ≥92%, double-sided development uniformity ≤3%

3 product features
Reduced product defects through non-contact transmission
Compatible processing of dry film/resistive soldering materials
Compared with existing horizontal devices, it can increase the yield of magnetic rails and special physics by about 5% defoaming design